ITEM
Current
2009year
Max. layer
22L
35L
Line thickness/gap
Inner layer
75/75um
Out layer
100/100um
Min. drilling head diameter
100 um
50 um
ratio
12.5:1
15:01
Copper thickness
5 oz
6oz
Impedance control
¡À10%
¡À5%
Base Material
High frequency/micro-wave material
¡Ì
Non-halogen material
Rigid-Flex board
Lead free material
¡ª¡ª
Metal base material
copper/alu
High Tg
170¡æ
8 layers
12layers
Surface Finish
OSP¡¢ENIG¡¢Flash Gold¡¢Immersion Tin¡¢HASL¡¢Tin Plating¡¢Immersion Silver
SMT
SMD Package£º0201¡¢BGA£¬Cell Phone board£¬FPC
