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ITEM

DATA

REMARK

Min. Line Width(Mil)

4

Min. Space(Mil)

4/5

4mil for Gold finger

Min. pad(Mil)

PTH: 4Mil

The distance between the hole edge and the pad edge¡£

Component hole£º7Mil

Min. hole diameter

Board thickness< 2.0mm

0.2mm

Finish hole¡£

Board thickness¡Ý2.0mm

Aspect ratio ¡Ü8

Finish hole¡£

Max. Board thickness

Single-layer / double-layer

3.2mm

0

Multi-layer

6.0mm

Min. Board thickness

Single-layer / double-layer

0.2mm

Multi-layer

4 layer:0.4mm£»6 layer:0.8mm£»8 layer:1.0mm£»10 layer:1.2mm

 

The distance between the line and board edge

Milling:0.20mm

V-CUT: 0.4mm

Max. layer

22

Solder Mask

Solder mask opening(Mil)

2/4

1. only one side£»2.the tolerance is within 2 mil in order to avoid the exposure of solder mask dam.

Solder mask dam (Mil)

6

Between IC pins¡£

Color

white, black, blue, green, yellow, red and so on

Legend

Min. space(Mil)

5/8

Color

White, yellow, black and so on

Surface Finish

Plating Tin¡¢Plating Ni/A, ENIG and so on

Plating layer thickness

technology

thickness

Minimal thickness

Maximal thickness

Gold plating

Au.thickness

100

150

Nithickness

1

3

ENIG

Nithickness

100

150

Au.thickness

1

5

Gold finger

Ni. thickness

120

150

Gold thickness

5

30

Hole copper£¨micron£©

Copper thickness

20

25

Base copper thickness

Copper thickness of inner and out layer£¨oz£©

0.5

6

Finish copper thickness

Out layer

1

6.5

Inner layer

0.5

6

PP thickness(mm)

0.06

----

Line width/space(mil)

Max. copper thickness

0

4/4(Gold finger);4/5;

0.5oz

0

The line width is not less than the required in condition of keeping the line space.

6/7

1oz

0

8/8

2oz

0

8/12

3oz

0

5oz

0

Base material type

FR-4; alu. Base material£»high frequency material£»PTFE£»FPC£»super-thick copper clad laminate£»paperboard£»BT material£»Pi material£»Rogers4003 (PPC:4403)